System Solution Group (SSG)
From Innovation to Realization- We at SSG enable our customer’s ideated concept to the Product realization. We bring to the table a cutting edge technology with high caliber engineers who transform these concepts through end-to-end system design and development.
Key Technologies
Systems Hardware Design & Test Solution Development
FPGA RTL – Design & Development
Semiconductor Package design and prototyping
Layout Design & Simulations engineering
Software Design &
Development
Key Domain Expertise: An end-to-end solutions provider
Silicon Engineering
- Fabrication and OSAT Management
- Package Design
- ATE Test & Characterization
- Reliability Qualification
- System Level Test Low volume / Pilot run production
System Engineering
- System Architecture – HW & SW
- System Hardware/ Software / FPGA FW design
- Test Bench Development
- Qualification against standards
- Pre-compliance Test
- Productization
High Calibre Package & PCB Design / Simulation / DFM / CAM Validation -> Volume Manufacturing
System Hardware Design Capabilities
for volume production / wafer level testing
in collaboration with Packaging & PCB Design experts
Characterization and Validation of new Silicons
Specification to Productization including Compliance testing
High speed Interfaces (PCIe, DDR, LPDDR, SGMII, RGMII, CXL, MIPI – CSI and DSI)
Industry popular FPGA technology based designs
Design of high-voltage boards with battery management systems
Full Qual support – EVT, PVT, DVT and Thermal stress requirement
Design compliance for MIL, JSS and DO standards
Product compliance testing including Thermal cycling, Thermal shock and vibration
Characterization / Functional testing
Measurement of Electrical Parameters:
Rise time, Fall time, VIH, VIL, VOH, VOL
Clock measurement – Jitter, Overshoot, Undershoot, Rise & fall time
Device performance across PVT using Thermal Management System
Automation framework for recurring measurements across PVT
High Speed Transceiver validation using BERT & measurement of Eye-pattern
Power Sequence, Ripple, Load and line regulation, Transient response, Load Test using Digital electronic
load.
Package & PCB Design Capabilities
Package design 2.0D, 2.5D and 3.0D technologies
Stack-up: Multi-layer HDI with Blind and buried vias
Impedance Controlled Designs – Megatron 6, 7N, Rogers, EM890
Board Thickness: Ranges from 1mm
Board Size: Based on ATE form factor / End Application Requirement
High Speed Interfaces routing: QSFP, PCIE, Different types of DDR interfaces like
UDIMM, SODIMM, RLD RAM, QDR and CLAM Shell
High density Component design
Design of Increased layer count and thickness with drill size as low as 4mil
Signal integrity – IL,RL, LCR Extraction and eye-pattern
Power integrity – IR drop, AC simulation and DC coupling
Thermal Analysis – Board Level, Module level and System levels
Structural Simulation
EMI/EMC Analysis – RE, CE, RS and CS.
System Software Capabilities
U-Boot customization (optimized boot time)
BSP development & Porting
Linux, Android, WinCE and RTOS platforms
HW Platforms – ARM / PowerPC / x86, Industry popular FPGA+SOC etc.,
Middleware for Multimedia, Graphics, Connectivity and File systems
Firmware for DSP, FPGA programming
Test Application SW – Functional Testing / System Level Testing
Multiple HD video streams encode and decode
Plugins for hardware and software codecs
Integration of wide range of AV codecs on TI DSM, ARM & x86 Processors
H.265/HEVC, H.264, H.263, VC-1, MPEG-4, MJPEG
Network streaming with RTP, HTTP, TCP, UDP, IGMP, FTP protocols
Customization (Framework, UI level) for Android, QT and UI development using NXPPEGPRO
FPGA based design & HDL Coding (VHDL / Verilog)
Industry popular FPGAs / SOCs from Xilinx, Intel, Lattice and Microsemi etc.
FPGA platforms and tools =>realization of high complex FPGA-based systems.
Design / Develop & Integrate different types of interfaces
JESD standard – High Speed Data Converters (ADC’s & DAC’s)
Memories(DDR2,DDR3,DDR4), SRAM, EEPROM / Flash.
Ethernet, HDMI, CAMLINK Transceiver, PCIe, SDI,SDH,RS232,RS422,RS485 etc.
