Defining
Connectivity
PoweringExcellence
DefiningConnectivity
Powering
Excellence
Our Vision
Kaynes Semicon
, our vision is to be at the forefront of semiconductor innovation, seamlessly integrating intelligence into everyday devices, and catalyzing a future where technology enhances the human experience.
Discover the Kaynes Semicon Advantages for IC Packaging
INNOVATION LEADERS
QUALITY ASSURANCE
GLOBAL REACH,
LOCAL COMMITEMENT
COLLABORATIVE PARTNERSHIP
Our Vision
Committed to excellence in semiconductor manufacturing, our mission is to be the go-to provider for cutting-edge packaging and testing solutions. We strive to exceed industry standards, elevate customer satisfaction, and contribute to the success of our customers.
Our Values
Innovation
Quality Excellence
Integrity
Employee Empowerment
Sustainability
Customer Focus
Global Citizenship
Collaboration
Future Focused
Adaptability
Innovation
Quality Excellence
Integrity
Employee Empowerment
Sustainability
Customer Focus
Global Citizenship
Collaboration
Future Focused
Adaptability
Our Packages
Quad Flat No-leads
(QFN)
(QFN)
Small Outline
Transistor (SOT)
Transistor (SOT)
Transistor Outline
(TO)
(TO)
Ball Grid Array
(BGA)
(BGA)
Multi-chip Module Packages (MCM)
Flip Chip Chip Scale Packages (FCCSP)
System in Packages
Solutions (SIP)
Solutions (SIP)
Co-packages
Optics
Optics
Highlights
CHAIRPERSON
Hence the R&D line for OSAT in co-packaged optics space and a system for networking domain will be a true silicon-to-system from Kaynes Semicon.
Managing Director
We will bring experienced OSAT leaders from southeast Asia and Taiwan, and create an ecosystem of trained engineers, operators and technicians for India.
SENIOR VICE PRESIDENT - ENGINEERING
Our Test Roadmap and CapEx spending will cover Analog, Digital Mixed Signal, RF, Power, Memory and modules which will allow Kaynes to test from legacy packages to advance 3D and SiPh packages.
HEAD OF R&D
Joining Kaynes Semicon in its foundational phase in 2024 means being part of something truly exciting. We're not just building a facility; we're architecting a global leader in advanced packaging from the ground up. Our R&D is laser-focused on mastering and advancing the innovative technologies, including 2.5D/3D integration, chiplet strategies, and other cutting-edge packaging solutions, that will define that leadership.
HEAD OF NEW BUSINESS
At Kaynes Semicon, we are not just building facilities, we are building futures. By integrating global expertise with local talent, we aim to position India as a strategic hub for OSAT services and advanced semiconductor manufacturing.
Highlights
Hence the R&D line for OSAT in co-packaged optics space and a system for networking domain will be a true silicon-to-system from Kaynes Semicon
Savitha Ramesh
We will bring experienced OSAT leaders from southeast Asia and Taiwan, and create an ecosystem of trained engineers, operators and technicians for India
Ramesh Kannan
From its first OSAT plant, the company is primarily looking to serve automotive electric vehicle (EV) and industrial segments. The plant will have a couple of chip assembly lines. "In the EV domain, we will be focussing on power modules pack- aging. The second vertical we will go after is industrial, where we will look after micro-controller units (MCUs).
Raghu Panicker
Our Test Roadmap and CapEx spending will cover Analog, Digital Mixed Signal, RF, Power, Memory and modules which will allow Kaynes to test from legacy packages to advance 3D and SiPh packages
Azni Abd Rahman
Joining Kaynes Semicon in its foundational phase in 2024 means being part of something truly exciting. We're not just building a facility; we're architecting a global leader in advanced packaging from the ground up. Our R&D is laser-focused on mastering and advancing the innovative technologies, including 2.5D/3D integration, chiplet strategies, and other cutting-edge packaging solutions, that will define that leadership.
Wasi Uddin
At Kaynes Semicon, we are not just building facilities, we are building futures. By integrating global expertise with local talent, we aim to position India as a strategic hub for OSAT services and advanced semiconductor manufacturing.
Ramachandran Ramalingam
Aatma Nirbhar Bharat Abhiyan
Make In India
We are also actively involved in Electronics Manufacturing Cluster 2.0, an ESDM initiative by the Government of Karnataka.
