Reliability & Failure Analysis
Kaynes Semicon PVT LTD
Offers fast, efficient and cost effective means of performing reliability and full turn-key qualification & testing solution of Semiconductor IC package, Semiconductor IC product. Provide PCBA reliability test and Failure Analysis service using state of the art equipment and Engineering expertise.
Device Qualification Tests
- High Temperature Operating Life (HTOL) JESD22-A108/JESD85
- Early Life Failure Rate (ELFR) JESD22-A108/JESD74
- Low Temperature Operating Life (LTOL) JESD22-A108
- Latch-Up (LU) JESD78
- Human Body Model ESD (ESD-HBM) JS-001
- Charged Device Model ESD (ESD_CDM) JESD22-C101
Package Qualification Tests
- MSL Preconditioning (prior to package tests) (PC) JESD22-A113
- High Temperature Storage (HTS) JESD22-A103 & A113
- Temperature Humidity Bias (THB) JESD22-A101
- Biased Highly Accelerated Temperature & Humidity Stress (BHAST) JESD22-A110
- Unbiased HAST (UHAST) JESD22-A118
- Temperature Cycling (TC) JESD22-A104
Failure Analysis
- IC Package nondestructive analysis
- IC Package destructive analysis
- Package chemical Decapsulation
- SAM Analysis
- SEM Analysis
- EDX Analysis
- IC/PCBA Cross section Analysis
- X-Ray Analysis
- Liquid Crystal Analysis
Compliance Standard
- JEDEC
- MIL-STD
- Automotive Standard AEC-Q100
PCB Design/Fab/Assembly
- HTOL Burn-in-board
- bHAST board
- ESD
- HTOL Daughter board
Device Qualification Tests
- High Temperature Operating Life (HTOL) JESD22-A108/JESD85
- Early Life Failure Rate (ELFR) JESD22-A108/JESD74
- Low Temperature Operating Life (LTOL) JESD22-A108
- Latch-Up (LU) JESD78
- Human Body Model ESD (ESD-HBM) JS-001
- Charged Device Model ESD (ESD_CDM) JESD22-C101
Package Qualification Tests
- MSL Preconditioning (prior to package tests) (PC) JESD22-A113
- High Temperature Storage (HTS) JESD22-A103 & A113
- Temperature Humidity Bias (THB) JESD22-A101
- Biased Highly Accelerated Temperature & Humidity Stress (BHAST) JESD22-A110
- Unbiased HAST (UHAST) JESD22-A118
- Temperature Cycling (TC) JESD22-A104
Failure Analysis
- IC Package nondestructive analysis
- IC Package destructive analysis
- Package chemical Decapsulation
- SAM Analysis
- SEM Analysis
- EDX Analysis
- IC/PCBA Cross section Analysis
- X-Ray Analysis
- Liquid Crystal Analysis
PCBA Reliability Test
- Thermal Shock Test (IEC-60068-2-14)
- Thermal Cycling Test(IEC-60068-2-14)
- Temperature / Humidity cyclic Test(IEC 60068-2-38)
- LifeTime / Humidity Bias Test(IEC 60068-2-38)
- Low Temperature and High Temperature Storage Test(IEC 60068-2-14)
- Vibration Tests(IEC 60068-2-64, IEC 60068-2-6)
- SALT MIST CYCLIC(IEC 60068-2-52)
- Glithes(IEC 60068-2)
- Shear/pull test(IEC 62137-1-2, IEC 62137-1-1)
- Ionic Contamination(IPC-J-STD001)
- Altitude(IEC 60068-2-13, IEC 60068-2-41)
- Shock(IEC 60068-2-27)
- Temperature(IEC 60068-2-1, IEC 60068-2-2)
- Humidity(IEC 60068-2-56)
- Radiated Immunity(EN61000-4-3)
- Power-Frequency Magnetic Field Immunity(EN61000-4-3)
- Electrostatic Discharge Test(EN61000-4-2)
- Radiated Emisson(EN55011)
- Electrical Fast Transients(EN 61000-4-4)
- Conducted immunity(EN 61000-4-6)
Kaynes Semicon PVT LTD
offers fast, efficient and cost effective means of performing reliability and full turn-key qualification & testing solution of Semiconductor IC package, \Semiconductor IC product.
Provide PCBA reliability test and Failure Analysis service using state of the art equipment and
Engineering expertise.
Package Qualification Tests
- High Temperature Operating Life (HTOL) JESD22-A108/JESD85
- Early Life Failure Rate (ELFR) JESD22-A108/JESD74
- Low Temperature Operating Life (LTOL) JESD22-A108
- Latch-Up (LU) JESD78
- Human Body Model ESD (ESD-HBM) JS-001
- Charged Device Model ESD (ESD_CDM) JESD22-C101
Package Qualification Tests
- MSL Preconditioning (prior to package tests) (PC) JESD22-A113
- High Temperature Storage (HTS) JESD22-A103 & A113
- Temperature Humidity Bias (THB) JESD22-A101
- Biased Highly Accelerated Temperature & Humidity Stress (BHAST) JESD22-A110
- Unbiased HAST (UHAST) JESD22-A118
- Temperature Cycling (TC) JESD22-A104
Compliance Standard
JEDEC
MIL-STD
Automotive Standard AEC-Q100
PCBA Reliability Test
- Thermal Shock Test (IEC-60068-2-14)
- Thermal Cycling Test(IEC-60068-2-14)
- Temperature / Humidity cyclic Test(IEC 60068-2-38)
- LifeTime / Humidity Bias Test(IEC 60068-2-38)
- Low Temperature and High Temperature Storage Test(IEC 60068-2-14)
- Vibration Tests(IEC 60068-2-64, IEC 60068-2-6)
- SALT MIST CYCLIC(IEC 60068-2-52)
- Glithes(IEC 60068-2)
- Shear/pull test(IEC 62137-1-2, IEC 62137-1-1)
- Ionic Contamination(IPC-J-STD001)
- Altitude(IEC 60068-2-13, IEC 60068-2-41)
- Shock(IEC 60068-2-27)
- Temperature(IEC 60068-2-1, IEC 60068-2-2)
- Humidity(IEC 60068-2-56)
- Radiated Immunity(EN61000-4-3)
- Power-Frequency Magnetic Field Immunity(EN61000-4-3)
- Electrostatic Discharge Test(EN61000-4-2)
- Radiated Emisson(EN55011)
- Electrical Fast Transients(EN 61000-4-4)
- Surge(EN 61000-4-5)
- Conducted immunity(EN 61000-4-6)
Failure Analysis
- IC Package nondestructive analysis
- IC Package destructive analysis
- Package chemical Decapsulation
- SAM Analysis
- SEM Analysis
- EDX Analysis
- IC/PCBA Cross section Analysis
- X-Ray Analysis
- Liquid Crystal Analysis
PCB Design/Fab/Assembly
- HTOL Burn-in-board
- bHAST board
- ESD
- HTOL Daughter board
Compliance Standard
- JEDEC
- MIL-STD
- Automotive Standard AEC-Q100
